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생산기술

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컴인테크 생산능력

Key factors 2017년 2018년

Max.layer count

46 Layers

48 Layers

Min./Max. Board Thickness(inch)

0.276

0.315

Copper thickness Inner Layers(inch)

0.000695 / 0.00276

Standard

Copper thickness Outer Layers(inch)

0.00193 / 0.00399

Standard

Min. finished Hole size(inch) Board Thickness

0.0118 / 0.126, 0.0157 / 0.189

0.00984 / 0.126, 0.0118 / 0.189

Min.Line Width/Space Outer Layers(inch)

0.00276

0.00197

Min.Line Width/Space Inner Layers(inch)

0.00197

0.00118

Impedance Control(%)

7%

5%

Surface Finish

HASL/OSP/Immersion Gold/
Hard Gold/Immersion Silver

HASL/OSP/Immersion Gold/
Hard Gold/Immersion Si